Select a language
As global industrialization partner & turnkey special machinery provider, BMG is serving the dynamic and fast-growing eMobility, Battery and Energy market. All common market segments are covered — from small ultrasonic sensors to vehicle computers and control units, all the way up to large power electronics. As a full-liner with more than 100 assembly lines operating worldwide & 20 years of experience BMG integrates joining, laser processing, dispensing, handling, robotics, and optical inspection into modular, scalable and standardized production line concepts.
Are you facing the challenge of producing electronics in more variants – faster, error-free, and with long-term investment security? We show you how it can be done. With more than 20 years of experience and over 100 assembly lines in operation worldwide, Bosch Manufacturing Solutions | BMG delivers turnkey Sensors & Electronics production equipment that combines proven Bosch quality with deep process expertise. Our strength lies in the development, integration, and orchestration of innovative processes – for both proprietary and third-party machines – into stable, scalable production systems. Key technologies such as dispensing, laser welding, laser cleaning, flexfoil handling, screwing, press-fit & single pin insertion, and optical in-line inspection ensure maximum flexibility, consistent quality, and 100% traceability. Enhanced by Digital Engineering and Data Driven Manufacturing, our solutions accelerate time-to-market, reduce scrap, and optimize overall equipment effectiveness (OEE). With modular design, stepwise scalability, and built-in digital intelligence, BMG provides future-proof production systems that turn complexity into competitiveness.
We offer fully automated handling solutions down to ±0.02 mm accuracy even for flexfoils and cables, using sensors, vacuum grippers, and dual-end effectors to ensure precision and speed. Changeable grippers and anomaly detection enhance flexibility and uptime across product variants.
Our magnetic conveyor system enables high-speed transport of lightweight components with ±0.025 mm repeatability. Modular, PLC-controlled stations and double-track design support parallel workflows, reduce carrier count by up to 70%, and allow seamless access without halting the line.
Force/way-controlled pressfit and single pin insertion technologies enable robust, repeatable connections between PCBs and components. Supporting PCB sizes up to 400 x 400 mm and pressing forces up to 50 kN, the system handles a wide variety of pin types with cycle times from 2 to 15 seconds.
Five selectable insertion modes, fast tool changes, and integrated vision inspection ensure high yield and adaptability across electronics and automotive applications. Scalable from semi-automatic to full automation, it supports efficient ramp-ups, remote control, and minimal downtime.
High-precision application of 1C/2C materials - including adhesives, sealing compounds, and thermal interface materials - is managed across workpiece sizes up to 640 x 400 mm (or customized). Positioning repeatability of ±0.2 mm and dosing from 20 mg to >2 kg ensure process versatility. Features include 2D/3D AOI integration, automatic mask changers (up to 9), and SPC tools with 0.1 mg resolution. Proven in over 200 stations, the system delivers fast changeovers, compact design, and reliable, repeatable results – while lowering costs and maximizing flexibility.
Fast and precise screwdriving solutions cover vertical, oblique, and horizontal applications using M2 to M8 screws. Cycle times of 3.8 to 7.6 seconds (including feeding) are achieved with torque- and angle-controlled tightening, ideal for both metal and plastic components.
Vacuum screwdriver options ensure technical cleanliness, while robot or axis integration offers flexible, automated assembly. This approach guarantees secure joints, reduced contamination, and consistently high-quality results for demanding electronics production.
Electrical connections in ECUs are joined using a laser welding process. The system handles a wide range of materials (e.g., copper, aluminum, steel) and thicknesses starting from 20 µm.
Gap-free clamping, 2D/3D scanning optics, and contamination-free welding ensure cleanliness and connection integrity. With automated tool changes and AI-powered weld quality analysis, the process supports consistent output and reduced maintenance demands.
Short-pulse lasers clean die-cast aluminum surfaces before dispensing, removing oxides and organic residues across surfaces up to 800 x 800 mm. Treatment speeds reach up to 100 cm²/s, with achievable surface energy >70 mN/m and RFU < 3.
Advanced suction systems eliminate emissions entirely. The result is improved bonding, reduced material waste, and consistently clean surfaces that enhance downstream process reliability.
Our automated optical inspection solutions (AOI) for sensors & electronics provide comprehensive in-line quality control throughout the electronics assembly process - covering pin placement, marking validation, dispense pattern accuracy, and laser weld seam integrity.
High-speed imaging systems operate with scan rates up to 150 mm/s and precision down to ±0.1 mm. Equipped with advanced technologies such as 2D/3D cameras, laser triangulation, and white light interferometry, they detect even the smallest deviations.
Integrated MES connectivity and real-time defect visualization enable fast root cause identification and traceability. These modular systems reduce manual inspection effort, minimize scrap, and ensure compliance with demanding industry standards - while adapting to varied product types and production environments.
Klaus-Peter Proll | Sensors & Electronics